Industry News | 2019-10-08 06:12:57.0
SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
Industry News | 2019-11-25 11:02:32.0
SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.
New Equipment | Cleaning Agents
CYBERSOLV® C8622 is a full strength solvent blend specifically designed as an IPA alternative in stencil wiping and manual bench top cleaning applications. Easy to use, C8622 is applied in applications where IPA is typically used. Safe IPA Alterna
Industry News | 2013-08-14 11:42:55.0
From September 4-6, 2013, visit Kyzen in booth 106 at SEMICON Taiwan to learn more about its advanced cleaning solutions. Information about both MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry will be available in Kyzen’s booth at the TWTC Nangang Exhibition Hall in Taipei City, Taiwan.
Industry News | 2014-05-31 13:05:49.0
Kyzen announces plans to exhibit in Booth #5752 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2014-08-05 09:24:40.0
Kyzen will exhibit MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in booth 1226 at SEMICON Taiwan, which is scheduled to take place at TWTC Nangang Exhibition Hall in Taipei City, Taiwan from September 3-5, 2014.
Industry News | 2014-08-05 09:27:30.0
Kyzen will exhibit MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in booth 1226 at SEMICON Taiwan, which is scheduled to take place at TWTC Nangang Exhibition Hall in Taipei City, Taiwan from September 3-5, 2014.
Industry News | 2025-01-06 20:31:59.0
SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero-halogen solder paste is specifically designed for fine-pitch applications, including SMT processes and portable devices such as smartphones.
Industry News | 2010-04-11 03:15:20.0
The Balver Zinn Group announces that Cobar Europe BV has been awarded an NPI Award in the category of Soldering Materials for its Aquasol Branded Water Soluble solder paste. The award was presented to the Stan Renals, CEO of the Cobar Division during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2018-05-20 18:31:27.0
SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.
