Industry News | 2019-05-13 17:42:18.0
SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
Industry News | 2020-10-27 12:41:51.0
SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
New Equipment | Solder Materials
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder
Career Center | San DIego (Mira Mesa), California USA | Engineering,Maintenance,Production
Duties: Supports, develops and optimizes manufacturing processes. Reviews quality metrics to help produce high quality, repeatable processes. Assists with supporting and improving the SMT process (print process, placement, reflow, package-o
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Industry News | 2015-09-28 10:29:02.0
Introducing LOCTITE GC 3W – The first ever water soluble / water wash temperature stable solder paste.
Industry News | 2015-09-29 22:17:04.0
Indium Corporation's Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2010-03-26 23:54:25.0
The Balver Zinn Group announces that Cobar Europe BV will introduce its new Aquasol Branded Water Soluble solder paste in booth #1876 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
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