Industry News | 2008-02-29 16:13:23.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2021-05-21 03:56:59.0
LED lamp bead because of energy saving, low carbon environmental protection, no strobe, no radiation, high brightness, low heat advantages are gradually replacing the fluorescent lamp on the market, its application scope is expanding,although LED has many advantages, if the production or operation is not appropriate,there will be LED strip use fault phenomenon. LED lamp strip manufacturers also begin to pay more and more attention to the problem of production quality, then what equipment can be used for LED lamp strip backlight detection? Unicomp Technology here recommended AX8200L LED strip backlight detection equipment.
Industry News | 2016-02-15 17:53:06.0
Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.
Industry News | 2016-02-17 17:43:57.0
Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.
Industry News | 2015-12-01 11:36:04.0
XJTAG, a world leading supplier of boundary scan technology, announces the release of Version 3.4 of its Development System, which introduces major improvements in the visibility into complex systems during all phases of electronic product development and manufacture.
Industry Directory | Manufacturer
Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
Industry News | 2014-03-27 11:31:00.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25.
Industry News | 2018-04-25 20:05:59.0
SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.
Industry News | 2018-05-16 19:57:33.0
SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
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