Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
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New Equipment | Industrial Automation
SMT PCB Vacuum Loader Suction loader Power Source: 220-230VAC Maximum PCBs Capacity 300 pcs Cycle Time Approx. 6 seconds Power Consumption 180VA max Product description: SMT PCB Vacuum Loader Suction loader Bare Board Loader, Power Source: 220
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
Industry News | 2019-01-22 16:00:09.0
At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.
Industry News | 2011-06-24 18:52:10.0
Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.
Industry News | 2009-03-06 14:54:52.0
Everett Charles Technologies will display advanced technologies in booth A44 at the upcoming Bits BGA Socket Workshop, scheduled to take place March 8-11, 2009 at the Hilton Phoenix East/Mesa Hotel Mesa in Arizona.
Industry News | 2008-04-23 20:01:36.0
The new View X x-ray system from Scienscope International is the latest in X-Ray inspection systems designed to inspect printed circuit boards for solder joint integrity. The View X x-ray system is a cost effective inspection solution for both OEM's and contract manufacturers alike.
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