Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2011-09-14 11:38:51.0
Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder, will present “A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low-Silver Solder Alloys” at the upcoming IPC Midwest Conference & Exhibition.
Industry News | 2011-12-02 14:20:53.0
BB Electronics, a full service EMS company, announces that it has completed the installation and integration of the new VJ Electronix 400 Scavenger system into its Horsens, Denmark facility. BB Electronics will use the noncontact solder removal system to enhance the reliability of its rework operations of highly complex circuit boards.
Industry News | 2012-04-27 14:46:36.0
The Balver Zinn/Cobar Group introduces Tempotac (120-TEM), its newest next-generation tacky flux.
Industry News | 2013-10-22 12:00:17.0
Panasonic Factory Solutions Company of America announces the appointment of Systems, Materials, & Technologies Inc. (SMT Inc.) as a sales representative of Panasonic electronics assembly solutions in Northern California and Northwest Nevada.
Industry News | 2015-02-04 17:49:57.0
Vi TECHNOLOGY will participate in the PCB manufacturing processes workshop, scheduled to take place April 21-23, 2015 at the Kintner Equipment Corp. facility in Endicott, New York. ACE Production Technologies, Inc. has partnered with Kintner Equipment Corp. to conduct the free workshop.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Industry News | 2010-06-23 11:36:12.0
Siplace presented a solution to NOTE satisfying their wide ranging needs
