Electronics Forum | Wed Jan 03 11:14:26 EST 2007 | realchunks
What is your biggest failure mode? You root cause problem could be anything from poor ICT fixture to bad incoming inspection. Generally, BGA's are a high yield producing component. Just cause they're neat-o doesn't make em' bad. As for 85% yiel
Electronics Forum | Mon Mar 10 04:15:22 EDT 2008 | grantp
Hi, We have had a few vendors push automatic solder paste inspection devices on us in the past, and I have resisted until now. However we have a new product with a micro BGA on it, and I am worried about yield, so am considering it seriously for th
Electronics Forum | Mon Nov 13 09:00:07 EST 2006 | pavel_murtishev
Good afternoon, 1. Never heard that phosphorus crystals formation creates difficulties with BGA soldering. Two points to check are reflow process and screen printing process. BGA package is designed to have extremely high yield. 2. Title: Reflow So
Electronics Forum | Fri Apr 17 16:00:52 EDT 1998 | Michael Allen
X-ray can be helpful in trouble-shooting BGA component failures. Test techs can quickly determine whether or not a BGA has solder bridges. When a bridge is found, this can eliminate hours of trouble-shooting. And when a bridge is not found, the te
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Fri Jun 23 08:31:11 EDT 2006 | davef
Sounds like we're going to get questions on how to improve yields on QFP, eh?
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith
I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.
