Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs
We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem
Electronics Forum | Fri Mar 19 07:06:27 EST 2004 | george
Vijay: If you are still having difficulty or are frustrated with your yields try http://www.solder.net. They work on the most difficult packages and boards.
Electronics Forum | Fri Aug 10 19:49:32 EDT 2001 | nifhail
What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclud
Electronics Forum | Wed Sep 08 17:28:11 EDT 1999 | Earl Moon
| | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | Hi Chris, | Why don't you process a double side reflow and use selective wave fixture for wave process. The process w
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Thu Jul 18 09:55:05 EDT 2002 | gdstanton
Mike, When we measure solder inspection yield by dividing the number of defective joints on a CCA by the total number of joints on the PWB. A defective joint is classified only once. That is we don't count multiple defects on the same joint. Our
Electronics Forum | Tue Jan 16 14:10:14 EST 2001 | bdoyle
what was the error message you were receiving? I just did a search for BGA in the forum using the search on the gray bar at the top and it yielded 71 results. I didn't have any errors when I clicked on them. Email me if you have continued troubles
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