Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Thu Jul 18 15:21:32 EDT 2002 | gdstanton
Steve, Seriously we really do that much. Don't know much about your stuff but our designs typically have as much as five 144 pin QFPs on each CCA. Boards are small and double sided with BGA and uBGA. We build some high reliability space stuff and w
Electronics Forum | Wed Apr 11 14:57:31 EDT 2007 | itwasbill
Hi all! We are placing BGA's using a QSV-1 pck and place machine. I believe our profile has the correct information but we continue to get vision results not available when we inspect the part. Our screen appears as follows: NO RESULTS AVAILABLE PAR
Electronics Forum | Wed Feb 06 16:05:24 EST 2008 | dphilbrick
At one point in time we were putting TI NanoStar parts on these particular boards. You don't want to attempt this at home! Thank God they took them off. Part was 1.45 X 1mm with 6 .1mm balls. They were a pain in the A$$. We had about a 90% success ra
Electronics Forum | Wed Jun 11 09:58:35 EDT 2003 | swagner
Solder fillet inspection is something that I would avoid like SARS, solder joints are like a snowflake no two are the same, henceforth unrepeatability. The only time I would look into this would be for uBGA or flipchip on an audit basis utilizing X-
Electronics Forum | Tue Sep 14 09:13:34 EDT 1999 | Chris McDonald
| | | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | | | | | Hi Chris, | | Why don't you process a double side reflow and use selective wave fixture for wave process. T
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Wed Nov 23 19:50:23 EST 2016 | gmscribe
Hi guys, I'm working on a design involving a 223-pin BGA with 0.5mm pitch (ball size 0.3mm) with a 16-bit DDR3 controller involved. Currently routing a track between two balls is resulting in a track width of 0.1mm and a spacing of 0.077mm. Now the
