Industry Directory: bixenman (1)

Magnalytix

Industry Directory | Consultant / Service Provider / Manufacturer

Leader in electronics cleanliness reliability testing–elevating consistency & confidence. Our Objective Evidence system improves reliability for electronics manufacturers and OEMs.

Industry News: bixenman (148)

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

Industry News | 2017-08-01 06:08:55.0

The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

Surface Mount Technology Association (SMTA)

SMTA Announces Best of Conference From 2012 SE Asia Technical Conference

Industry News | 2012-06-08 07:14:00.0

SMTA just announced the Best of Conference Award recipient from the South East Asia Technical Conference on Electronics Assembly Technologies that took place April 18-20, 2012, in Penang, Malaysia. The Best of Conference Award was presented to Mike Bixenman, Kyzen Corporation, for his workshop on "Designing for Reliability - Cleaning Basics in the Age of High Density Interconnects." The workshop was very well-attended and received high scores from attendees.

Surface Mount Technology Association (SMTA)

Technical Library: bixenman (12)

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Technical Library | 2010-06-10 21:01:48.0

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.

KYZEN Corporation

Stencil Printing Yield Improvements

Technical Library | 2014-06-05 16:44:07.0

Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.

KYZEN Corporation

Events Calendar: bixenman (2)

Webinar: Process Control to Ensure Electrochemically Reliable Electronics

Events Calendar | Wed Mar 24 18:30:00 UTC 2021 - Wed Mar 24 18:30:00 UTC 2021 | ,

Webinar: Process Control to Ensure Electrochemically Reliable Electronics

Surface Mount Technology Association (SMTA)

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Surface Mount Technology Association (SMTA)

Express Newsletter: bixenman (9)

SMTnet Express - July 20, 2017

Bixenman, DBA - KYZEN Corporation As electronic device

SMTnet Express - July 27, 2017

SMTnet Express, July 27, 2017, Subscribers: 30,636, Companies: 10,649, Users: 23,563 Electrochemical Methods to Measure the Corrosion Potential of Flux Residues Mike Bixenman, DBA, David Lober, Anna Ailworth - KYZEN Corporation , Bruno Tolla, Ph

Partner Websites: bixenman (32)

IPC APEX EXPO 2021 Professional Development Courses | IPC APEX EXPO 2021

| https://ipcapexexpo.org/ipc-apex-expo-2021-professional-development-courses

: Mark McMeen and Mike Bixenman, Magnalytix PD26: Troubleshooting and Process Optimization  - Lessons Learned from the Trenches and a Decade of Board Talk - Part I Phil Zarrow & Jim Hall

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness

| https://www.eptac.com/blog/ipc-medical-industries-technical-conference-lead-free-reliability-readiness

., CEO and Managing Partner – DfR Solutions 3:45 pm           Lead-free PCB Cleanliness Requirements Dr. Mike Bixenman, CTO – Kyzen Corporation 4:45 pm


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