Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary
Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Tue May 06 22:54:08 EDT 2003 | davef
tommyg_fla. Sorry about being late getting back you. Surface-active species, such as Fe2+, Mn2+, NH4+, and H+, can be adsorbed onto solid phases [and transported by things as weird as bioturbation or advection not that they have anything to do with
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi
| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).
Electronics Forum | Fri Nov 05 18:47:31 EDT 2010 | eadthem
I'm guessing when you say bare board you mean wet paste only? When you say the pads move slightly are your boards warped at all at the Vscore? What we do is use per modual fids. first you delete or don't make panel fids and then theres a option wh
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
