Electronics Forum | Mon Aug 24 18:45:11 EDT 1998 | Steve Evers
| We are looking at implimenting a bar code system for a SMT | production line. To start we are looking at label printer/applicators. Are there any other companies that we should consider besides Zebra and Imtec?? Thanks for your input. | John If
Electronics Forum | Tue Aug 25 21:01:45 EDT 1998 | Peter
We use an Intermec 3240 Thermal transfer printer and print on polyimid label material that survives the reflow and wave solder (top side only) process without turning black. Labels run around 3-4 cents per depending on the size (We found Imtec label
Electronics Forum | Fri Feb 22 08:26:51 EST 2002 | davef
You are correct. The gold dissolves in the solder. The gold is meant to protect the nickel from oxidizing, so that you can solder to the nickel. Obviously that didn�t work as planned. Your background information is very sparse. Two things come
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary
Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Tue May 06 22:54:08 EDT 2003 | davef
tommyg_fla. Sorry about being late getting back you. Surface-active species, such as Fe2+, Mn2+, NH4+, and H+, can be adsorbed onto solid phases [and transported by things as weird as bioturbation or advection not that they have anything to do with
