Full Site - : black nickel (Page 5 of 13)

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 11:56:04 EST 2000 | Dave Pearcy

We are experiencing the same problem. We just spent $1,200 to figure out that the "black stuff" is a Nickel Oxide. I am going to look into the profile end of this problem. Any suggestions would be very helpful. Dave

Solder Ball 'fell off'

Electronics Forum | Mon Apr 18 11:26:38 EDT 2005 | davef

Whenever we hear "gold" and "balls falling off", we think of black pad [hypercorrosion of nickel]. What does your EDX show?

BGA & PCB - solderability issue

Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef

Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an

ENIG-BLACK PAD!!!!

Electronics Forum | Tue Dec 05 21:19:14 EST 2006 | Jack

Hi Doug, I think you are right..Let me do some EDX on other location to see any nickel oxide...BTW, is this black pad reworkable?? If yes, how? Thanks in advance,..

Sulfamate Nickel Finish

Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave

Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro

Black Pad

Electronics Forum | Tue Jan 10 20:56:45 EST 2006 | davef

Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b343900f7010VgnVCM100000f932a8c0

Black PAD

Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef

We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b

Lead Free finish

Electronics Forum | Mon Nov 03 11:20:08 EST 2008 | boardhouse

Vlad, That was a bad statement to make... Enig should never be thicker than 5 micro inches max. or it will cause embrittlement. This process does self limit but it can put on as much as 10-14 Micro inches which would be a major cause of concern.

ENIG

Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman

If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 11:00:00 EST 2009 | tstrat

That is interesting, I have not seen that as a requirement before. From what I read if it is less than 7 wt% the corrosion resistance is pretty low, but if the value is too high it indicates that "black pad" is present from nickel corrosion. From wha


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