Industry News | 2020-03-08 16:23:52.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
Industry News | 2024-07-26 03:15:33.0
From 2023 to 2024, one piece of equipment has seen a remarkable surge in sales within I.C.T's extensive product lineup: the Selective Solder Machine. This unexpected rise in popularity has left many wondering, why this particular machine? Today, we embark on a journey to uncover the story behind the Selective Solder Machine's success. We'll explore its innovative features, the benefits it brings to electronics manufacturing, and the reasons why it has become the go-to choice for industry leaders. Join us as we dive deep into the compelling narrative of why the Selective Solder Machine is taking the market by storm.
Industry News | 2022-10-12 11:23:36.0
In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Technical Library | 2023-01-06 16:09:03.0
The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.
Parts & Supplies | Assembly Accessories
SPACER MTNK000242AA ASL-328E GROMMET MTNK000283AA C-30-NG-79-G-EP-UL GROMMET MTNK000474AA C-30-NG-79-J-EP-UL BOLT N510000323AA Hexagon socket button head screw M3X6 Steel Black oxide finish 12.9 SPACER MTNK000653AA CL-404E BOLT N510017517AA
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
Parts & Supplies | Assembly Accessories
M8X10-10.9 A2J (Trivalent) JOINT N510066458AA KQ2L06-02AS ORIFICE-RING N210157884AB BRACKET N210201229AC SWITCH N510037368AA S D4N-1122 JOINT KXF06F4AA00 53015030-WM Feeder Cart Guide(Front Side):NPM-W N610120771AA BRACKET N210153442AA
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