Parts & Supplies | Assembly Accessories
PIN N510020600AA MMS4-25 SENSOR N610080223AA GT7SN CYLINDER N610076227AB CDQSBS12-20-DCL7078L CYLINDER N610076228AB CDQSBS12-20-DCL7078L CYLINDER N610082929AB CDQSBS12-20-DCL7078L CYLINDER N610121090AB CDQSBS12-20-DCL7078L CYLINDER N61012
Parts & Supplies | Assembly Accessories
LINEAR-WAY N510040427AA SSR15XV2UUE+605LY-II(00995183G020) JOINT MTNP000832AA M-5H-4-X83 SPACER N510019911AA CB-302E BOLT N510000323AA Hexagon socket button head screw M3X6 Steel Black oxide finish 12.9 Tray Feeder Lift Section:NPM N610069932
The modern design of the machines and the physical laws of the process permit to defect-free soldering of the most complicated SMT assemblies even with lead-free solder pastes. The machines are particular suited for users who process product with fr
Technical Library | 2010-03-04 18:11:53.0
While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb-free soldering, established trends of increasing functionality and miniaturization have continued. The increasing use of ultra-fine pitch and area-array devices presents challenges in both printing and flux technology. With the decrease in both the size and the pitch of said components, new problems may arise, such as head-in-pillow and graping defects
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
