Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Mar 20 09:50:42 EST 2003 | Jodi Roepsch
We have not found a way to rework boards successfully at this time. Boards with severe black pad get scrapped.
Electronics Forum | Mon Aug 29 08:44:57 EDT 2016 | jrrt_williams
As an OEM repiar tech I would run into "Black Pad" on occasion, though mostly on surface mount pads. The only way I could remove the oxidation was to apply water soluble flux and add solder, then wick away the excess. This left me with a suitable s
Electronics Forum | Mon Jun 27 11:01:58 EDT 2016 | mufflerbearings
From the pic, it looks like you have a bad board; ENIG process issue. It used to be called black pad for SMT but I'm sure it's the same condition for T/H. Any good electronic lab should be able to id the black stuff. I would also send raw boards bac
Electronics Forum | Fri Nov 08 14:32:23 EST 2002 | juan_ruiz
Thanks Doug! I will follow your recomendations.
Electronics Forum | Wed Feb 12 09:42:46 EST 2003 | genny
The issue is on the web. The current issue is February, so check for past issues at http://www.circuitsassembly.com/
Electronics Forum | Thu Feb 20 10:48:01 EST 2003 | bernard
Hi Jodi, You helped write the circuit assembly article , so why the question ?
Electronics Forum | Thu Feb 20 16:30:36 EST 2003 | larryk
Maybe she wanted everyone to read her article?
Electronics Forum | Fri Mar 14 14:55:48 EST 2003 | Paul.malone@teradyne.com
What current desity package would you draw the line for the use of ENIG (imm. IO count/ etc
Electronics Forum | Wed Apr 02 23:21:24 EST 2003 | scottf
Make the move to Silver Immersion, no nickel to mess with!
