Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Wed Feb 12 08:46:13 EST 2003 | dphilbrick
Get the January 2003 issue of Circuits Assembly Mag. It has more than you could ever want to know about this topic.
Electronics Forum | Wed Feb 12 17:32:53 EST 2003 | MA/NY DDave
Hi And Thanks. I couldn't find it with the link you gave. And I don't have my magazine with me. I love a click that gets me RIGHT THERE YiEng, DDave
Electronics Forum | Thu Feb 13 09:34:33 EST 2003 | genny
Did it take you to the magazine website? Just scroll down to where it says magazine on the left side, choose past issues and pick January. I think it was the featured article. Or try this to go right to that article. http://www.circuitsassembly.com
Electronics Forum | Tue Mar 11 13:50:23 EST 2003 | MA/NY DDave
Hi David F, You are GREAT!! You must have read my mind by posting this notice so our intial responder can tune in if she so wishes. YiEng, MA/NY DDave
Electronics Forum | Mon Mar 17 15:51:35 EST 2003 | MA/NY DDave
Hi A GREAT come back!! After a Wait to see "Show and Tell" To change the topic you launched a little. Who has or has had, this ENIG problem??? A simple yes or no with some detail. YiEng, MA/NY DDave
Electronics Forum | Thu Mar 20 07:26:22 EST 2003 | davef
Jodi We too have had little success with the approach described in the referenced paper. What method do you use?
Electronics Forum | Fri Mar 14 23:41:11 EST 2003 | MA/NY DDave
Hi Well maybe someone else has better info yet I don't see this fully associated with density of package. As long as the process gives a good Electroless NI, Immersion AU you should be OK. If it doesn't and the process output is marginal as has been
Electronics Forum | Mon Mar 17 15:32:33 EST 2003 | Jodi Roepsch
Thanks to everyone who took my question seriously and made an effort to share information on this topic. I have done extensive literature searches on this topic in the past but am still looking for more information regarding how this defect affects
