Electronics Forum | Sat Dec 23 03:46:13 EST 2006 | Jack
Hi Davef, I think you are right..Rgds, Jack..
Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean
Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc
Electronics Forum | Tue Jan 10 08:34:45 EST 2006 | jax
I am not sure how you know you have "Black Pad"... Did you have one of the boards Cross Sectioned and Analyzed by an outside source? If yes, I would go back to the Fab House for the total cost of the product you currently have at the full 200 piece q
Electronics Forum | Tue Jan 10 20:56:45 EST 2006 | davef
Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b343900f7010VgnVCM100000f932a8c0
Electronics Forum | Tue Jan 10 22:10:58 EST 2006 | davef
Muse We don't believe that the IPC TM-650 Test Methods Manual, 2.4.1E, Adhesion, Tape Testing--5/04 [ http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf ] that you refer to is a "black pad" test. We think it's a method for testing the a
Electronics Forum | Wed Jan 11 10:08:28 EST 2006 | muse95
This was the test method mentioned to me about 5 years ago, to use for testing for black pad, when we were evaluating the use of gold immersion for the first time. It is not practical for testing the entire surface of a PCB, but it should work well
Electronics Forum | Wed Jun 14 11:32:44 EDT 2006 | muse95
There is an IPC test method involving a tape test, which you can try for a start. Look at the IPC TM-650 free on the IPC site. Black pad occurrences are much reduced, but I don't believe you can say they never happen, even to the better board houses
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Fri Jun 16 10:23:40 EDT 2006 | pms
Thanks Davef, We recommend ENIG to our customers at this time, we have not had any customers reporting issues with it so far. I like the protection of the nickle from copper dissolution during wave in a PB free scenerio, but the "Black-Pad" issue i
Electronics Forum | Thu Dec 21 22:17:42 EST 2006 | davef
Waving the board will sweap away the crud of black pad and to produce a solderable surface, but this surface may have too much solder and may not be very flat. This can create problems when printing paste and placing and soldering components, depend
