Full Site - : black pad pull test (Page 9 of 22)

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef

On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you

Black pad defect on gold plated boards

Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin

Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you

BGA Pull test

Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.

When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Wed Aug 24 22:11:36 EDT 2016 | davef

I'd guess that "black pad" is not the issue that you need to address, because only 2 of your 5 test points has the problem that we seem to be discussing. I'd expect "black pad" problems to be more wide spread. Something is going on at those two locat

Black pad defect

Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch

I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than

Black pad defect

Electronics Forum | Mon Mar 17 15:32:33 EST 2003 | Jodi Roepsch

Thanks to everyone who took my question seriously and made an effort to share information on this topic. I have done extensive literature searches on this topic in the past but am still looking for more information regarding how this defect affects

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship

Black Pad?? (PICTURES)

Electronics Forum | Mon Oct 20 17:06:43 EDT 2008 | davef

Patrick You're correct that black pad analysis is a distructive test. Kicking the lead-free dog certainly is easy [and somewhat fun] to do, but black pad is an equal opportunity defect. It affects leaded boards as well as it does with lead-free.


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