SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Industry News | 2010-09-28 10:51:42.0
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks will present a paper titled “Issues and Concerns in Cleaning Under Low Profile Components” at the upcoming SMTA International, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
AQUBE® L Series For process safe fine cleaning of assembled PCB’s and Hybrids The new kolb AQUBE® systems are next-generation cleaning systems – even more efficient, even more compact, easy to handle and
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
New Equipment | Fabrication Services
Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
Industry News | 2010-04-28 20:24:38.0
NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks held a successful presentation at the SMTA Silicon Valley Chapter meeting, which took place on Thursday, April 22, 2010 from 3-5:30 p.m. at EET, Inc. in Reno, NV.
New Equipment | Assembly Services
25.0 um (>1mil) 6Max. Board Size: (580mm×1200mm) 7Min. Drilled Hole Size:4mil(0.1mm) 8Min. Line Width:3mil (0.075mm) 9Min. Line Spacing:3mil (0.075mm) 10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
Industry News | 2014-09-19 20:19:38.0
KYZEN is pleased to announce that Dr. Mike Bixenman will present the paper titled “QFN Design Considerations to Improve Cleaning – A Follow on Study” at the upcoming SMTA International exhibition.
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