New Equipment | Rework & Repair Equipment
Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is id
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
Electronics Forum | Thu Mar 25 19:01:57 EST 2004 | Dreamsniper
Oh Wow! Thanks a lot guys...I learned a lot from your good and spot on knowledge. You guys are really very helpful. Thanks Dreamy
Electronics Forum | Thu Mar 25 12:20:21 EST 2004 | Mike Konrad
OK� Nap time�s over! Technically speaking, water soluble flux is just that, soluble in water. Technically speaking, one does not need a saponifier or any other chemical agent to remove water soluble (OA) flux residues. However, one must conside
Used SMT Equipment | Pick and Place/Feeders
8mm, 12mm, 16mm, 24mm, 32mm, 44mm IQ ( Intelligent ) Surface Mount Tape Feeders and tape feeder reel arms for QUAD Q series and C series pick and place machines. These are the newer 8 pin, deep pocket, feeders and they will work on the newer intellig
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Parts & Supplies | Assembly Accessories
YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z
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Parts & Supplies | Pick and Place/Feeders
> www.greensmt.com JUKI E9572729CA0 LA (L) CABLE ASM. SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95737290A0 MTC I/F(L) CABLE ASM. www.greensmt.com JUKI E95738550A0 DISPESE SV ASM SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E95747210A0 BAD MARK SENSOR CAB
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
One unit currently in stock for immediate shipment. Ships from California. The Chip Off Model 620 SMD Rework System features touch screen operation and programming, upper and lower spot hot air heaters, ceramic coated area heaters, HD Split-Vision
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
, this show brings all the prime suppliers under one ro
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-curing-application.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » UV Curing Dispense Pumps UV Curing Materials Dispense Pumps UV Curing Dispense Pumps - Resin, Epoxy, and Glue Adhesives UV Curable adhesives such as resin, epoxy, and glue are adhesives cured under UV light
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/passivation-layer-shear?con=t&page=5
. Products Content Your results for: Passivation Layer Shear Composite Material Testing Nordson DAGE X-Ray / Bondtester Reliability Study of BGA Devices
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