Industry Directory | Manufacturer
We have a world class deflashing solution for removing mold bleed in lead frames in the Electronics industries.
Moog provides highly reliable components to the engine marketplace for demanding applications such as anti-icing control, bleed and surge control, variable geometry control and thrust vector control. For more information please visit our website
5 W/mK) No Resin Bleed
Electronics Forum | Wed Jan 09 12:53:55 EST 2013 | scais
Hello, We are having issues to solder components. We investigate the issue and found that the pads were having extra gold on the sides. Is it normal? Can we remove this gold 'bleeding from our PCB?' Thanks
Electronics Forum | Thu Jan 10 08:59:15 EST 2013 | rway
It appears the gold bleeding spans the gap between the plates, is this correct, or is it just the picture? If so, it should definitely be removed. Please clarify on what we are looking at.
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Parts & Supplies | Chipshooters / Chip Mounters
161877 BODY, MACHINED FORMFLEX MK2 44 PIN 161805 BLEED NIPPLE, O-RINGS, M10x1 161787 END CAP (AIR & BLEED) 161684 RETAINER, BLEED NIPPLE COMBINATION 161683 BLEED NIPPLE, COMBINATION 161650 PIN, 6mm SEALING (LONG) 161605 MOULDED TUBE, FIT
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3020&OB=ASC.html
. The industry's latest bleeding-edge high-speed design, RF antenna, flex-circuitry, and design for manufacturing (DFM) technology in the Allegro PCB Designer gives you what you need to deliver the innovative products your customers demand
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