Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
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Product Desciption: 1.stencil clean rolls are Suitable for SMT machines of MPM, DEK, JUKI, ERKA, FUJI, SANYO, YAMAHA, Panasonic, KME and Minami brands 2.Wiper material: 56g, 65g, 68g, PGI55g, Mesh cloth. Material designed specifically for SMT screen
Industry News | 2018-05-30 16:32:42.0
ACL introduces two new lint-free wipe materials for critical cleaning to its Contamination Control line for applications which require pristine surfaces and extrinsic contamination removal.
Industry News | 2019-12-04 14:15:24.0
Engineered Material Systems, Inc. (EMS) is pleased to introduce CI-2069 Series carbon conductive inks for target resistance printing. CI-2069 Series inks feature excellent printability and stable resistance. The new ink series is offered in a suite of electrical resistance ranges.
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
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