Full Site - : blind micro vias (Page 10 of 52)

Colonial Circuits, Inc.

Industry Directory | Manufacturer

For 30 years, Colonial Circuits has been a leading full-service manufacturer of high-quality circuit boards serving the military, space and commercial markets.

FLALRPCB

Industry Directory | Manufacturer

FLALR PCB mainly specializes in  "Big volume, Rapid proofing" PCB, more than 10 years manufacturing experience, 

Toppan Electronics

Toppan Electronics

New Equipment |  

Multilayer PWBs BGA MCM Blind/Buried Via Buried Capacitance Buried Resistance Impedance Controlled

Toppan Electronics

GS Praezisions AG

Industry Directory |

GS Praezisions AG is a Swiss manufacturer of flex and rigid flex circuit boards. We spezialize in miniaturization and produce chip on board and flip chip substrates with micro via in laser and plasma technology among standard multilayer HDI PCBs.

Via in Pad PCB

Industry News | 2018-10-18 10:38:59.0

Via in Pad PCB

Flason Electronic Co.,limited

HDI PCB

HDI PCB

New Equipment | Other

High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:

A-Tech Circuits Co.,Limited

Ambitech, Inc

Industry Directory | Manufacturer

Ambitech specializes in the fabrication of high tech, complex printed circuit boards up to 44 layers.

Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper

Technical Library | 2019-06-26 23:21:49.0

Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.

MacDermid Inc.

HDI PCB

HDI PCB

New Equipment | Assembly Services

TW-HDI PCB 0245 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Year o

TW Technology Limited

NexCircuits

Industry Directory | Manufacturer

We specialize in Flex PCBs, Ridgid Flex, Long Flex PCBs and RF (radio frequency) Boards. Our engineering team has seen it all.


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