Industry News | 2016-05-16 20:32:11.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing, an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. Registration is required for this learning event.
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2018-02-07 17:52:33.0
The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2017-08-01 06:01:06.0
The SMTA Capital Chapter is pleased to announce that Phil Zarrow of ITM Consulting, will present “The ‘Deadly Sins’ of SMT Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2020-08-07 07:29:43.0
The SMTA Capital Chapter is excited to host its first FREE webinar on Wednesday, August 19th. The webinar will include an informative presentation given by industry expert Norman Armendariz, Ph.D. of Raytheon Company on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness."
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
Technical Library | 2009-12-14 20:24:19.0
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies.
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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