SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Blackfox Training Institute, LLC | https://www.blackfox.com/guide-to-a-successful-lead-free-soldering/
. When you transition to lead-free soldering, you will have to make some changes in the already established PCB-design rules. To guarantee manufacturability and dependability, industry guidelines regulate component lead-pad and land size, track width and spacing, via and through-hole dimensions, and other variables
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
interface and this is a defective condition. The reasoning of why this may be happening on only a few pads of a particular component is most likely due to the heat sinking characteristics of the pad/land area
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