Full Site - : blow holes in reflow process (Page 2 of 12)

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Pin In Hole, Pin in Paste or Selective Reflow CD from Bob Willis

Industry News | 2017-01-18 05:21:35.0

This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/

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What are the Steps in the Manual and Automated SMT Assembly?

Industry News | 2018-10-18 10:46:06.0

What are the Steps in the Manual and Automated SMT Assembly?

Flason Electronic Co.,limited

Wave soldering welding interview direct contact with high temperature liquid in the production

Industry News | 2018-10-18 09:29:21.0

Wave soldering welding interview direct contact with high temperature liquid in the production

Flason Electronic Co.,limited

Inovaxe Holds Successful Presentation at the “Achieving Zero Defects in the Small Component Assembly Process” Seminar

Industry News | 2009-06-29 07:20:22.0

SARASOTA, FL —June 2009 — Inovaxe Corp., a leader in delivering lean inventory control solutions to electronics manufacturers, announces that Ron Wrable held a successful presentation at the “Achieving Zero Defects in the Small Component Assembly Process” Seminar. The presentation titled, “MSD Storage and Inventory Control,” was held on Tuesday, June 9, 2009 at the Marriott Courtyard Hotel in San Diego, and Wednesday, June 10, 2009 at the Holiday Inn at the Long Beach Airport.

Inovaxe Corporation

Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components

Industry News | 2015-10-30 15:33:26.0

Indium Corporation announces the release of its newest informational video that describes how solder preforms can reduce voiding in bottom termination components.

Indium Corporation

Kurtz Ersa expands Mexico presence with new demo & technology center in Guadalajara

Industry News | 2016-10-30 20:48:24.0

Kurtz Ersa North America is pleased to announce the grand opening of its new demo & technology center in Guadalajara. Located at Av. Lopez Mateos Sur No. 1450 Int. L-7A, Col. Las Amapas, Tlajomulco de Zuniga, Jalisco, the grand opening celebration is scheduled to take place Nov. 17, 2016. Ersa continues to stay ahead of the curve with its award-winning reflow, rework, and selective soldering technologies, and the event will focus on the company’s future growth in Mexico and emerging technologies for its customers.

kurtz ersa Corporation

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

ViTrox Technologies to Debut New Capabilities of Its V810 X-Ray Inspection System in Asia at NEPCON China 2013

Industry News | 2013-04-16 16:05:34.0

ViTrox Technologies, will exhibit in Booth #1H60 at NEPCON China 2013, scheduled to take place April 23-25, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

ViTrox Technologies

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

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