Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Thu Sep 04 10:03:13 EDT 2003 | Rick B.
I'm attempting to develop paste in hole process so that I can reflow a few plated through hole components on a mixed tech board. Tried various pastes, profiles and stencil thicknesses. Would appreciate any insights and/or pointers anyone can share on
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Tue Mar 17 13:11:58 EST 1998 | ETS, LLC
ETS (Energy Technology Systems) is a manufacturer of Solder Reflow and Curing Ovens for the Electronics Industry. We offer a specially configured oven designed for processing of Pin in Paste processes as well as double sided mix technology boards. I
Electronics Forum | Tue Jun 04 11:14:48 EDT 2002 | ckd
Hi All - My question is how do solder balls form and stay in the vias? The assembly goes thru SMT top placement, reflow then thru hole components mounts on top side as well. The board is sent thru the wave solder process. Has anyone experienced this
Electronics Forum | Thu Nov 11 09:29:54 EST 2004 | rlackey
Wow, it's amazing what you can achieve with smoke & mirrors! Only joking. Does the original via hole covering solder get put on at the PCB fabrication plant, or by the customer? & Does the entire board get reflowed or do you have a process where ho
Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
