Full Site - : blow holes in reflow process (Page 7 of 13)

Re: No Clean in High Frequency Apps

Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon

| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?

How many company are there appling the Pihr (Pin in hole reflow) in SMT PROCESS..

Electronics Forum | Fri Aug 25 02:23:38 EDT 2000 | kyung sam park

Hi. smtguys Would you let me know the name of company appling the pihr in smt process. As you know PIHR stands for pin in hole reflow.( pin in paste) I just want to know what company apply the PIHR in smt process. I expect the contents of the c

Re: How many company are there appling the Pihr (Pin in hole reflow) in SMT PROCESS..

Electronics Forum | Thu Aug 31 00:07:24 EDT 2000 | Ramon I Garcia C

I Kyung: I'm not sure if we are working with PIHR but we insert some pines in a PCB with a pin inserter machine, after that we run this pcb in a screen printer and put over its solder paste, and then run in a chip shooter and then IC placer and f

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1

blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of

how to prenvent flux risidue in the blind vias.

Electronics Forum | Thu Feb 15 13:49:10 EST 2007 | russ

only plug one side, you can definitely blow out during reflow process with a sealed via/ it is impossible for flux to be trapped in a blind via. Russ

Re: Via in the middle of a pad

Electronics Forum | Mon Jan 10 10:02:57 EST 2000 | Istv�n Dominik

We had the same problems. Certainly the best solution to redesign the boards. Otherwise the holes must be plugged. We tried many solutions (more paste, printing twice etc.) but the result was almost the same. Finally we printed solderpaste only on th

Looks like we'll be BGAing in the near future

Electronics Forum | Thu Jan 31 15:13:20 EST 2008 | chef

You will need to develop your reflow profile which includes drilling a hole through the fab and into the ball for accurate temp measure. During profile/process development you will probably want 3D x-ray (consider contracting that out). Once in prod


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