Electronics Forum | Mon Apr 26 22:40:27 EDT 1999 | Dean
| | | | Hey Guys! | | | | | | | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | | | | | | | Whoever laid this
Electronics Forum | Fri Jun 15 14:05:20 EDT 2001 | CPI
In response No that�s not all you need to think about, but lets look at each and then talk of others. a)The condition of the solderable surface on boards (and components) degrades over time or can be supplied in poor condition (to thin or thick HASL
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
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Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Electronics Forum | Mon Apr 26 12:16:45 EDT 1999 | Justin Medernach
| Hey Guys! | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | Whoever laid this out, I'd like to go and do a
Electronics Forum | Mon Apr 26 17:32:32 EDT 1999 | Scott McKee
| Hey Guys! | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | Whoever laid this out, I'd like to go and do a
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
