Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed ：18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Used SMT Equipment | Pick and Place/Feeders
Device Name: Samsung SM411, Samsung SM411 Mater, Second-hand Samsung SM411 Mater Equipment Profile: The SM411 uses the Samsung Patent On The Fly identification method and the double cantilever structure to achieve the chip component 42,000 CPH and
Used SMT Equipment | Pick and Place/Feeders
Samsung SM421S automatic multi-function placement machine Mounting speed -Chip 21K CPH (IPC9850) -QFP 6K CPH (IPC9850) Volume should be components -Max. 0402 ~ □55mm(Part height H=15mm) Placement accuracy -±50@μ+ 3σ/Chip -&pl
Used SMT Equipment | Pick and Place/Feeders
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
Used SMT Equipment | Pick and Place/Feeders
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
Used SMT Equipment | Pick and Place/Feeders
Samsung SM411 parameters To the way the flight vision Number of Spindles 6 Spindles x 2 Gantry Mounting Speed Flying Vision Chip 1608 SOP 42,000 CPH (IPC9850) 30,000 CPH (IPC9850) Mounting accuracy Chip ± 50 μ @ 3σ / Chip (Base
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
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