Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH
All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o
Electronics Forum | Wed Dec 06 07:41:48 EST 2000 | John
To the post on the depaneling system. Almost any smt component can (and will according to Murphy's law) be damaged during hand breakout. Our company began using SMT a few years ago, and our primary customer absolutely will not allow us to hand brea
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Thu Jan 04 20:31:21 EST 2007 | Ben_T
Have you thought about an AOI system? With the system we have where I work, I'm able to run queries that'll tell me DPMO, yield, and pass/fail rates on a board level, part level, and opportunity level. Furthermore, this data can be broken down to see
Electronics Forum | Mon Mar 07 16:36:37 EST 2011 | remullis
I have been working on collecting data all day today. We are a OEM so our RMA and QA system is tied together. I have taken this data and broken it down by part type and individual boards. We had 264 (defects/rma returns) of that, 88 were NO Faults. O
Electronics Forum | Thu Nov 03 14:43:19 EST 2005 | chunks
Hmmmm.... We never had to change any parameters when switching over to Gels. And no, we don't let the operators have kitty-wampus on our programs either. The Gels did get rid of broken parts. We have Run Orders of about 50 pieces. We change over
Electronics Forum | Mon May 08 08:54:28 EDT 2000 | Lee Radney
Ok... Anybody got any quick, low cost ideas that can help me here? We run various panel layouts (all products are same width) thru our reflow oven. The problem is that due to the different layouts of our panels, the moveable center support chain
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
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