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HELLER Partners With Circuit Technology, Restronics

Industry News | 2024-06-06 21:18:44.0

Heller Industries announced two hirings today to strengthen their market position in the Eastern United States. Bob Doetzer, President of Circuit Technology Inc., has been appointed sales representative for North and South Carolina. Circuit Technology is a manufacturer's representative and IPC training group specializing in products and services covering circuit board production and semiconductor assembly.

Heller Industries Inc.

Heller expands Asian sales organization

Industry News | 2007-11-01 20:00:20.0

October 31, 2007, Florham Park, New Jersey � In continuation with its overall growth strategy, Heller Industries is pleased to announce the appointment of Mr. Wojtek Antoniak as Regional Sales Manager, Southeast Asia. Mr. Antoniak will be based in Singapore and will be responsible for sales management throughout Malaysia, Thailand, Vietnam as well as Singapore and the Philippines.

Heller Industries Inc.

Soldering Company of the Year 2020 - Heller Industries

Industry News | 2020-11-03 18:16:39.0

2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)

Heller Industries Inc.

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Industry News | 2014-09-06 19:18:17.0

Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

What is Underfill

Technical Library | 2024-03-19 15:53:34.0

Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global


board id warn searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Software for SMT placement & AOI - Free Download.
consignment program

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
convection smt reflow ovens

High Precision Fluid Dispensers
Electronic Solutions R3

Low-cost, self-paced, online training on electronics manufacturing fundamentals