Electronics Forum | Wed Jul 13 17:50:26 EDT 2016 | davef
From "Assembly" magazine, "Moisture-Sensitive Devices" [ http://www.assemblymag.com/articles/85082-moisture-sensitive-devices ] ... a description of the moisture sensitive device problem. I agree with Evtimov * During board assembly solder process,
Electronics Forum | Wed Jul 04 13:25:03 EDT 2012 | davef
Baking boards to remove moisture takes a lot more energy than you'd think. Following on with this, Chris Hunt from NPL gave a presentation at IPC APEX 2012 about the results of his research ["Impedance Testing for Sensitivity to Delamination in Print
Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi
Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with
Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt
170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can
Electronics Forum | Thu Sep 18 15:29:59 EDT 2003 | Gabriele
Hi all, by reading along those thread (SOT23) and Tan outgassing I learned plenty of things. My first time approacing this kind of Q$A Forum, very intesting tech communication way. Any way, the path of magnetism effect was chosen when time ago we met
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Fri Jan 04 09:01:35 EST 2008 | davef
Here's a link to the article that Loco references in the above post: http://www.smtnet.com/library/files/upload/DevelopingaReliable.pdf The table seems to be taking a simplistic approach. J-STD-020C, Table 4-2 lists nine catagories of MSL classific
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55
SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma
Electronics Forum | Wed May 19 07:38:42 EDT 2004 | Bob L.
I'm trying to help one of our remote sites solve a problem with a warped PBGA. The corners are lifted, creating columnar joints and the central balls are sometimes shorting. I've verified that it's not popcorning and I've got samples going to the l
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