Full Site - : board spacing (Page 2 of 328)

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

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For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

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DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

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Co-solvent Process Saves Electronics Manufacturer �45,000 a Year

Industry News | 2003-06-05 08:11:23.0

Kerry co-solvent system pays for itself in 13 months

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Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

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Rapid Prototyping Service Expands

Industry News | 2003-02-26 09:24:48.0

Accelerated Technologies, a provider of rapid prototyping, tooling and electronic manufacturing services, has announced the acquisition of a new and larger facility in Austin, Texas.

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SMTA INTERNATIONAL FT WORTH

Industry News | 2011-11-03 21:52:00.0

By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.

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University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

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Electronics Workbench Taps Industry Talent as New Vice President of Sales and Marketing

Industry News | 2003-03-04 08:31:59.0

Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market

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Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

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