Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Industry Directory | Distributor / Manufacturer
AllPoint Electronics is specialized in SMT, PTH, and TEST Equipment and services for electronics industry in Brazilian market. We provide full support for PCB assembly factory implementation, and process consulting
New Equipment | Board Handling - Conveyors
The NG OK vertical buffer is designed to buffer NG and OK board after inspection machine (AOI / SPI) and pass a OK board to next process.NG board will go to the upper conveyor for visual check.
New Equipment | Board Handling - Conveyors
Featuring MT Series NG Buffer, this equipment is used for separating and collecting NG boards all boards after testing equipment. This conveyor system adopts Panasonic PLC Program Control System, Japan SMC Cylinder, German Low Chain Cable, and SMEMA
New Equipment | Board Handling - Conveyors
Featuring MT Series NG Buffer, this equipment is used for separating and collecting NG boards all boards after testing equipment. This conveyor system adopts Panasonic PLC Program Control System, Japan SMC Cylinder, German Low Chain Cable, and SMEMA
Industry News | 2012-01-26 22:32:33.0
BPM Microsystems has added the model 2800ISP In-System Programming Station to its device programming product line. By incorporating its award-winning 8th Generation site technology utilizing Vector Engine® BitBlast into a custom-designed test fixture, BPM Microsystems’ 2800ISP allows customers to program flash architectures including eMMC, PCM and Raw NAND, plus microcontrollers and other device technologies on-board after reflow.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
New Equipment | Board Handling - Storage
A PCBAsstacker is a bare board unloader machine used to stack bare boards after the PCBAs production line processes, this machine usually uses a unique mechanism such as a pneumatic lifter that raises the PCBAs one by one from the belt conveyor and a
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
