Electronics Forum | Wed Mar 15 09:28:30 EST 2006 | mapell
Vick I would not think what your seeing is normal. Just guessing without a profile but.... - not reaching peak temperature - not enough soak time or mild ramp to burn away the flux - shortened TAL, not allowing proper time for the solder to wet - lo
Electronics Forum | Fri Sep 22 14:07:29 EDT 2006 | realchunks
I think Sr is right. Miss prints are prolly a result of your tooling moving the board after the camera looks at the fids. It also could be the camera itself hitting the board from warpped board or tooling raising the board up. It may be the camera
Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David
What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean
Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Electronics Forum | Tue Feb 19 14:52:04 EST 2008 | dphilbrick
You also need to understand when using something like a Q Cutter you should resolder the board after you cut! Your alternative is to get someting that when you put your part in it cuts and clinces the part. Contact Systems makes machines that present
Electronics Forum | Tue Dec 02 18:10:39 EST 2008 | sys_steven
Need your opinion guys.. The old timers at the plant here feel that we should clean our board after Misprints withe the solvent cleaner over water wash. This is so they don't have to rebake the pcb for 24 hours before smt again. I don't believe th
Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt
Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within
Electronics Forum | Fri Apr 23 10:18:48 EDT 2010 | spitkis2
Graham, When performing such a temperature variation test, do you attach the thermocouples so that they are in contact with the PCB's pads or are they reading the air temperature? If they are attached to the PCB, I take it you reposition the board
Electronics Forum | Thu Jun 28 09:40:49 EDT 2012 | austinpeterman
We just stepped into the inline wash world with a techical devices new clean galaxy plus. We are noticing a significant amount of foaming when washing our boards after selective solder. One theory is that the water soluble flux used is not being cu
Electronics Forum | Mon Sep 17 05:48:10 EDT 2012 | stivais
Hi Ben, Yes, this could be the reason but have you ever seen solderability issues for (new) boards with LF-HAL surface finish? I have seen this only if there are surface finish quality issues for bare boards (exposed copper etc.). In this case we di
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