Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Fri Jul 17 11:57:25 EDT 1998 | Justin Medernach
| I am looking for information on the amount of stress a component sees during the depaneling process. I am currently specifying a new piece of depaneling equipment and I have not found any studies that quantitatively compare the amount of stress di
Electronics Forum | Mon May 07 16:00:38 EDT 2007 | patrickbruneel
Dave, There is not really a �smart� or scientific way to check this but I know of easy ways and very effective ways. Fex. an easy way to check is with a 3� spatula, you hold the spatula at the same angle as the board and drag trough the wave simula
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Mon Jun 14 09:23:57 EDT 1999 | C.K.
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Mon Mar 13 04:37:13 EST 2006 | Daniel
Hi Experts, We have requirement from our customer to control the PCBA flatness at 10 mils diagonally. Weird but this is the requirement due to the need for some through hole pins (spreaded acroos the board must touch the copper sheet while they are
Electronics Forum | Sat Jan 19 10:56:26 EST 2008 | slthomas
Dave that's actually what I want to work on the next time we run these. Our issue with these right now is that weight distribution on the boards mandates that we break a 4-up panel into two pieces and run it 90 degrees to the ideal orientation (=s wh
Electronics Forum | Tue Oct 01 08:01:23 EDT 2002 | mjz289
WE USE A HELLER 1500 EXL OVEN (5 ZONE OVEN) AND HAVE BEEN DOING PBGAs FROM 292 TO 780 BALLS WITH .O32" PITCH (.8 mm) AND METAL STIFFENERS ON TOP WITH NO PROBLEMS. I AM GETTING 210 - 215 DEGREES C AT THE BGA BALLS WITH 50 - 65 SECONDS ABOVE LIQUIDUS
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Fri Jul 14 11:34:37 EDT 2000 | Mike F
John, The first thing to check is how tight the boards are being held in the conveyor (assuming you are using a finger conveyor). They should be a little loose at the input end so there is some room to expand. If the boards are held too tightly, when
