Industry News | 2016-01-31 12:28:05.0
Recent SMTA International Best of Conference Award Winner, Bob Willis, pledged a half of his winnings to the Charles Hutchins Educational Grant upon receiving notification of his award. Bob is a long-time SMTA member, workshop instructor and support of the organisation
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Industry News | 2016-10-19 11:39:22.0
Vision Engineering teamed up with industry expert Bob Willis to broadcast a free Electronics Academy Webinar Series aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The series ends in November but all the previous webinars are available on demand.
Career Center | Valley View, Ohio USA | Production
Machine operator to operate an automated through hole and Surface Mount Technology (SMT) industrial soldering machines. Operator should have 1 year hands on experience operating the Universal (Sanyo) GSM Platform Machine. Must be proficient en
Industry News | 2015-07-17 03:55:30.0
Join Bob Willis for two workshops at SMTA International on 27th September, Bob's birthday just happens to fall on the start of the conference.
Industry News | 2016-04-05 11:30:08.0
This mornings webinar was conducted on fine pitch rework and repair and include a survey of 72 company's. The recording is available on line at and a copy of the slides and survey results can be obtained direct from Bob Willis bob@bobwillis.co.uk
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
Industry News | 2017-09-28 15:07:29.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture.
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
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