Industry News | 2012-10-12 04:01:50.0
Package On Package Assembly Inspection & Quality Control Guide is the first text book covering every step in this exciting manufacturing and design lead technology and its going to be available FREE.
Industry News | 2015-04-05 11:23:49.0
Three new lead free text books reviewed by Bob Willis in his regular look at new technology, PCB manufacture and assembly titles See https://www.youtube.com/watch?v=IO9ra6O1Mdg
Industry News | 2017-01-21 08:16:49.0
Welcome to this Bob Willis “Defect of the Month” video This month we cover Poor Hole Fill on PCBs during Soldering https://www.youtube.com/watch?v=BlSF9ubGEA8
Industry News | 2007-10-08 23:41:16.0
Balver Zinn in Balve, Germany will be one of four sponsors of the Productronica 2007 special feature �Process Advice and Defect Clinic� being run by renowned industry expert Bob Willis.
Industry Directory | Consultant / Service Provider / Manufacturer
Cogiscan provides factory-wide electronics manufacturing traceability (TTC), MSD control, component set up verification, PCB assembly error-proofing, components inventory management.
Industry News | 2019-06-16 10:14:10.0
Bob Willis Defect of the Month explains solder joint voids and are they an issue to everyone? Bobs webinar guide to voids in solder joints and how to overcome them in manufacture is available online and covers all of the different voids and solutions from his archives see https://www.bobwillis.co.uk/product/online-webinar-archive-booking/
Industry News | 2023-08-22 15:55:12.0
The Robotic Soldering, Inspection & Defect Guide is the latest free process guide produced by Bob Willis. It features results on soldering with high & low temperature alloys
Industry News | 2021-11-05 11:20:37.0
Robotic Soldering Success & Low Temperature Assembly & Inspection Join Bob at the Virtual SMTA Int Conference for two 3hr workshop as part of SMTA International 2021 he will be presenting an interactive experience:
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Industry News | 2017-02-05 09:21:06.0
Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. For further details go to http://www.bobwillis.co.uk/event/solder-ball-elimination-in-wave-selective-reflow/
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