Industry News | 2018-07-03 04:09:30.0
Solder migration or Squeeze Out can be seen when solder reflows on packages which are underfilled and is feature on the NPL Defect Database and shows you what is happening
Industry News | 2020-04-01 06:00:44.0
We are running a Charity Webinar with two of the industry's leading magazines Circuits Assembly & Global SMT & Packaging magazine to help support engineers worldwide https://app.greenrope.com/users/myteam45084/Media437.html
Industry News | 2014-06-19 04:08:47.0
Prior to SMTA International we will be holding a pre event webinar which will be free for engineers to attend. It will provide an overview of the different process technology, process defects and showcase the show feature area covering High Temperature Electronics. The webinar will be held on Wednesday 10th September and presented by:
Industry News | 2012-02-17 14:25:10.0
Nordson DAGE will co-sponsor and participate in a Webinar titled “Package on Package (PoP) Assembly Process & Inspection” on Thursday March 15, 2012 from 2:30-3:30 p.m. GMT. Keith Bryant, Nordson DAGE’s Global Sales Director and SMART Group’s Chairman, will present industry-leading information about PoP inspection during the Webinar.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Industry News | 2015-09-14 17:31:42.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Electronics Forum | Wed Apr 07 14:43:27 EDT 1999 | Dick Casagrande
| | Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | | | I've seen QFP's on the backside and yes, they need glued prior to reflow - just a couple of drops on the corners. | | Scot
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
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