Electronics Forum | Wed Apr 28 21:48:03 EDT 1999 | Dave F
| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |
Electronics Forum | Fri Mar 20 04:09:57 EDT 2015 | robertwillis
Yes generally speaking yes if there is not contamination on the board from PCB manufacture. for dendrite formation you also need moisture and voltage during operation of the product. You can see many of my IPC Defect of the Month videos at showing yo
Electronics Forum | Wed Apr 07 14:43:27 EDT 1999 | Dick Casagrande
| | Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | | | I've seen QFP's on the backside and yes, they need glued prior to reflow - just a couple of drops on the corners. | | Scot
Electronics Forum | Thu Apr 29 17:18:29 EDT 1999 | JohnW
| | | Anyone using hot air nife for wave soldering process. | | | Does it work? | | | Does it really eliminate solder bridging and does it create any other problems? | | | | | | any feed back will be much appriciated. | | | | | | Thanks | | | |
Electronics Forum | Tue Dec 04 14:31:50 EST 2007 | davef
Search the fine SMTnet Archives for previous discussion. This technique has been called 'pin-in-paste,' 'paste-in-hole,' 'intrusive reflow,' 'alternative assembly and reflow technology' and who can remember all the other consultant buzz-words. Look a
Electronics Forum | Fri Apr 06 17:06:43 EDT 2012 | joeherz
Hello, We have been tracking our SMT quality levels using DPMO which has been a great way to monitor our process with a huge variation in products we build (we're an low vol/high mix EMS provider). We are now looking at implementing the same scheme
Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis
Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu
Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Fri Feb 17 09:35:00 EST 2006 | Rob
Hi, I take it you are refering to intrusive reflow? It came around as more components became available in surface mount packages leaving mainly connectors left over for a separate insertion operation & wave/selective/hand solder. Manufacturers imp
