Electronics Forum | Mon Jun 07 16:52:51 EDT 1999 | Dave F
| | | | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave sold
Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F
Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi
Electronics Forum | Mon Feb 26 19:56:24 EST 2001 | davef
SMTnet Archives used to have copious amounts of information on a pin-in-hole [e.g., pin-in-paste, paste-in-hole, etc] reflow process, but much of that appears lost with the conversion to the new and improved site format. In getting started, check:
Electronics Forum | Wed Apr 28 15:23:11 EDT 1999 | JohnW
| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton
| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis
| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys
