Industry Directory: bond (118)

ISVI - Industrial Sensor Vision International Corporation

ISVI - Industrial Sensor Vision International Corporation

Industry Directory | Manufacturer

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Bond Impex

Industry Directory | Manufacturer

we requrie screen printing two part adhesive

New SMT Equipment: bond (274)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Thermal Transfer, Thermal Interface Materials

Thermal Transfer, Thermal Interface Materials

New Equipment | Materials

We are well versed in the following thermal application materials:     Sil-Pad thermally conductive insulators     Gap-Pad thermally conductive gap filling material     Q-Pad thermal grease replacement film     Bond-Ply thermally conductive adh

ORION Industries

Electronics Forum: bond (636)

COB and wire bond

Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh

Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you

Used SMT Equipment: bond (37)

Manncorp PBS213 Hot Bar Soldering

Manncorp PBS213 Hot Bar Soldering

Used SMT Equipment | Soldering - Selective

Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W

SMTUNION

Dage 4000 pull tester machines

Dage 4000 pull tester machines

Used SMT Equipment | Labeling Systems

CBP / TP 5Kg Cold Bump Pull/ Tweezers Pull Cartridge along with JAW Nordson Dage 4000 Bond Tester DAGE 4000 CBP/TP 5KG Qty:2  Condition : Excellent working condition with many Modules all form Europe user Email:13560819457@139.com

HongCheng import & Export co.,Ltd

Industry News: bond (959)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

Parts & Supplies: bond (45)

DEK Polyurethane Bonded Squeegees 45° 483mm

DEK Polyurethane Bonded Squeegees 45° 483mm

Parts & Supplies | Pick and Place/Feeders

DRIVE BELT^RAIL WIDTH DEK 185938 DRIVE BELT^TABLE LIFT DEK 185934 DEK Q-250D COVERS SYSTEM SWITCH LOOM BOM DEK DEK 163512 BELT, TIMING (16T10/1970), PAIR DEK 129250 BELT, TIMING (16T10/2350) DEK 129268 PRINT CARRIAGE MOTOR ( TXT ) DEK 13312

Qinyi Electronics Co.,Ltd

Technical Library: bond (56)

Staking/Epoxy Adhesive Dispensing for Aerospace

Technical Library | 2023-08-16 18:48:50.0

One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"

GPD Global

Adhesive Bonding Instead Of Welding Or Bolting

Technical Library | 2019-05-01 10:07:37.0

Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.

Scheugenpflug Inc.

Videos: bond (63)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Training Courses: bond (5)

Counterfeit Component Prevention Training Course

Training Courses | | | Other Courses

Other courses related to electronics manufacturing and assembly

Blackfox Training Institute, LLC

Chip Scale Manufacturing Training Course

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ACI Technologies, Inc.

Events Calendar: bond (24)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Quality Adhesive Technologies from LOCTITE - Free Workshop

Events Calendar | Tue Jun 04 00:00:00 EDT 2019 - Tue Jun 04 00:00:00 EDT 2019 | Philadelphia, Pennsylvania USA

Quality Adhesive Technologies from LOCTITE - Free Workshop

ACI Technologies, Inc.

Career Center - Jobs: bond (27)

Wire/Die bond Engineer

Career Center | Milwaukee, Wisconsin USA | Engineering

Responsible for all Wire and die bond process within this fast growing Microelectronics company. Company is constantly upgrading equipment and processes to compete in the fiber optics arena. Company will either hire fulltime or a contract worker who

Excel Enterprises L.P.

Wire bonding engineer

Career Center | San Diego, California USA | Engineering

MeltroniX is a supplir of MCM/hybrids for the military and space market. We are seeking a process engineer with expertise in wire bonding, including ultrasonic and thermocompession technology.

MeltroniX Inc

Career Center - Resumes: bond (9)

Sales

Career Center | Chennai, India | Sales/Marketing

Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali

Technical Specialist

Career Center | SanPedro, Philippines | Maintenance,Production

Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan

Express Newsletter: bond (127)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding

Partner Websites: bond (2700)

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Strong Adhesive Bond SMT Cover Tape Extender 8mm SMT Joint Tape Black ESD

KingFei SMT Tech | http://www.smtspare-parts.com/sale-8530771-strong-adhesive-bond-smt-cover-tape-extender-8mm-smt-joint-tape-black-esd.html

Strong Adhesive Bond SMT Cover Tape Extender 8mm SMT Joint Tape Black ESD Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech


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