Industry Directory | Manufacturer
CoorsTek Gaiser invented the ceramic bonding tool. Our precision wire bonding tools include ceramic capillaries, wire wedges, ribbon wedges, ceramic/cermet wedges, die collets & vacuum pick-up tools.
Industry Directory | Manufacturer
Expertise and equipment to support the most intricate and challenging wire bonding applications. Fine wire wedge bonders, heavy wire bonders, ribbon bonders for backend semiconductor assembly.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas
Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you
Used SMT Equipment | Semiconductor & Solar
Becoming available soon; K&S 4124 Wire Bonding Machine currently in production to be removed in complete working condition. Contact: Assured Technical Service LLC Minneapolis, MN 55441 AssuredTechnicalServiceLLC@Gmail.com FOB Origin. The
Used SMT Equipment | SMT Equipment
ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Career Center | Brooklyn, New York USA | Engineering,Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Viktoria Rawinski Abstract 31-2 Understanding the Higher Wire Bond Strength Advantage of Au/Pd/Au (IGEPIG) as Compared to Alternate Immersion Gold Finishes, Before and After Heat Treatment with Different Types of Wires Tatsushi Someya, Tetsuya Sasamura, Ph.D
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