Full Site - : bondability of gold (Page 2 of 18)

Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2023 Announced

Industry News | 2023-09-13 15:57:54.0

In conjunction with NEPCON Vietnam 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 6-8, 2023. This tenth competition got "heated" as 35 contestants from 13 electronics companies in Vietnam vied for top prizes.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

IPC Announces Results of the IPC Rework Experience Competition at SMT Hybrid Packaging International Exhibition and Conference 2016

Industry News | 2016-06-15 20:20:37.0

The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.

Association Connecting Electronics Industries (IPC)

IPC Study Identifies Costs of SEC Conflict Minerals Due Diligence at 17 Times More than Government Estimates

Industry News | 2011-03-11 14:53:57.0

A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.

Association Connecting Electronics Industries (IPC)

The New S3088 ultra gold — the Best of the Best 3D AOI Systems

Industry News | 2016-03-18 11:58:14.0

Viscom today announced to introduce a new variant of its successful S3088 ultra 3D AOI system, at SMT in Nuremberg. The S3088 ultra gold reaches image data rates of up to 3.6 gigapixels per second. The core of this system is the innovative high performance camera module XMplus with its outstanding, high throughput camera technology.

Viscom AG

Smart Tweezers ST5 - A New Generation of Digital Multimeters

Smart Tweezers ST5 - A New Generation of Digital Multimeters

New Equipment | Test Equipment

Smart Tweezers, from Canadian, Siborg Systems Inc., are the inventive combination of a powerful LCR-meter and a set of tweezers integrated into a pocket-sized device. Designed specifically for working with electronics using Surface Mount Technology,

Siborg Systems Inc

HANDY & HARMAN

New Equipment |  

Reel-to-reel plating; Wire bondable Gold, Silver, Copper, Nickel,...

West-Tech Materials

Multichip modules (MCM-L)

New Equipment |  

Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.

Metro Circuits, div. of PJC Technologies, Inc.

Updated Model of Smart Tweezers: the ST-5S

Industry News | 2014-05-16 12:37:30.0

Siborg Systems Inc. releases Smart Tweezers ST-5S, an updated model of the popular ST-5 model.

Siborg Systems Inc


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