Full Site - : bonders (Page 14 of 31)

Finetech Unveils High Force ACF Bonder

Industry News | 2013-11-08 18:07:48.0

Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.

Finetech

GKG Asia Announces a Successful productronica Exhibition in Germany

Industry News | 2013-11-20 16:52:27.0

GKG Asia Pte Ltd announces that it participated in the recent productronica exhibition that took place November 12-15, 2013 in Munich, Germany and reports that the show was a complete success.

GKG Asia Pte Ltd

TG-1000 Hotbar Bonding System for Small Displays and Wearable Products

Industry News | 2017-05-26 14:54:11.0

Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning

Toddco3

ASM Pacific Technology Reaches Milestone with 250th Thermo-Compression Bonding Tool Shipped to Customers

Industry News | 2021-03-15 15:28:43.0

Semiconductor and Packaging Technology Leader Extends Leadership in Advanced Packaging and Heterogeneous Integration with High Volume Manufacturing Tools

ASM Pacific Technology

Hanwha Techwin Enters 45th Year as a Global Provider of Smart SMT Line Solutions

Industry News | 2022-01-10 16:44:56.0

Hanwha Techwin Automation Americas, formerly Samsung C&T Automation, is pleased to announce its 45-year anniversary. The company started in the machine tool business in 1977. Now, 45 years later, Hanwha is stronger than ever and has a global reputation for being a fair partner who focuses on quality and service, placing customers first.

Hanwha Techwin CO., LTD.

Fluxless soldering using formic acid vapor for optoelectronics

Industry News | 2023-11-20 15:33:13.0

Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky AG

FINETECH Appoints Axiomatek as Exclusive Representative in Mexico

Industry News | 2009-01-13 19:26:03.0

FINETECH, a provider of innovative equipment solutions for advanced rework and packaging and assembly applications, announces that Axiomatek will assume sales responsibility for the company's product line in Mexico. Axiomatek is headquartered in Santa Teresa, New Mexico and has multiple offices in Mexico.

Finetech

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech


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