Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
Industry News | 2023-11-20 13:52:50.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB1
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB2
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB3
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 1