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Tresky AG

Industry Directory | Manufacturer

Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.

Tresky unveils its latest breakthrough product at productronica 2023: the photonics bonder for sub-micron use in nano- and optoelectronics

Industry News | 2023-11-20 13:52:50.0

The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.

Tresky AG

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech


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