A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB1
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB2
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB3
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 1
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 2
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 3
Used SMT Equipment | Other Equipment
Looking for an F&K Delvotec g5 XL Bonder,. Please email me with details.
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