Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Career Center | San Jose, California USA | Research and Development
Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag
Used SMT Equipment | Semiconductor & Solar
Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug
Industry Directory | Standards Setting / Certification / Training Provider
Scanditron is a market-leading supplier of production equipment, material, support and training for electronic manufacturers in the Nordic and Baltic countries and Poland.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
Industry News | 2010-10-27 20:21:50.0
Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.
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