Full Site - : bonders (Page 8 of 41)

Assembly Resource

Industry Directory | Manufacturer / Manufacturer's Representative

Sales/Marketing, Manufacturers Representatives, Used Equipment Sales

KNS 4524-D Manual GOLD Ball Bo

KNS 4524-D Manual GOLD Ball Bo

Used SMT Equipment | General Purpose Equipment

Bonder appears to be in quite nice cosmetic condition, showing some signs of normal wear. Being sold refurbished and in working condition, with a 30-day parts warranty to the contiguous US 48 states only. 2 to 4 weeks allowance for refurbishm

karenmadison.com

Yamaha Flip Chip Bonder & Hybrid Placer

Yamaha Flip Chip Bonder & Hybrid Placer

New Equipment | Inspection

Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bo

Flasonsmt Co.,ltd

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company

KNS ConnX Plus

KNS ConnX Plus

Used SMT Equipment | Semiconductor & Solar

(8) K&S ConnX Plus Wire Bonders Vintage: 2014 & 2013 Good Functional Condition Includes Crating & Barrier Bagging Software/OS: VX Works (K&S original) Power: 200V Optical Binocular Microscope Quantity Available: 8 Available Immediately Jake

LEL Tech

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Industry News | 2013-04-13 00:16:30.0

Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.

Hesse Mechatronics

HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER

New Equipment |  

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal

CAD Design Software

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.


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