Full Site - : bonders (Page 9 of 32)

Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Industry News | 2012-02-15 20:06:32.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse Mechatronics

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Industry News | 2012-08-14 10:24:59.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario

Hesse Mechatronics

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

Engineering Specialist

Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control

Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg

Harris

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

Besi / ESEC 8800FC

Besi / ESEC 8800FC

Used SMT Equipment | Semiconductor & Solar

Besi #DC8800FC Quantum High Speed Flip Chip Bonder Offline Curing Machine w/Datacon #Etx 1.1 Port Controls, Scanner, Power Supply: 3/N/PE/208/220/240/400 VAC, 50/60Hz, (Serial#: 950 8874 3355) Auction will be on April 3, 2018 at 11 AM Online Throug

Paul E. Saperstein Co., Inc

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Industry News | 2013-06-20 19:12:14.0

Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

Tresky AG

Scanditron

Industry Directory | Standards Setting / Certification / Training Provider

Scanditron is a market-leading supplier of production equipment, material, support and training for electronic manufacturers in the Nordic and Baltic countries and Poland.

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

Fuji CP743E

Fuji CP743E

Used SMT Equipment | Chipshooters / Chip Mounters

(3) Fuji CP743E Chipshooters; 2003 - 2004 vintage. All consigned into the High Technology Exchange on March 12-14 on www.xlineassets.com List of additional equipment includes: TEST AND MEASUREMENT: Advantest Spectrum Analyzers Rhode and Schwa

X-Line Asset Management


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